TechXperience Summit, Germany

The TechXperience Summit 2027 will take place in Donaueschingen from March 17 to 19, 2027. The event brings together experts from the semiconductor industry to discuss the latest developments, technologies, and trends in the sector.

We are pleased to participate in this year’s TechXperience Summit 2027 as a Silver Sponsor. In addition to our role as an event partner, we will also have our own booth at the accompanying trade show. Our experts will be available there for one-on-one discussions.

Furthermore, we will be part of the conference program with a technical presentation on the topic “Electroless Cu Seed – TGV, PLP Metallization.”

For more information, please visit the organizer’s official website.