Semicon China is an important exhibition in the field of semiconductors and offers industry professionals the opportunity to exchange ideas. You can find us in hall N3, booth 3671.
Our product highlights
Umicore´s business line Electroplating have partnered with SHINHAO Materials to provide innovative patented additives for copper electroplating into the advanced packaging industry. SHINHAO´s modular additive system IntraCu®* embodies an integral part of our joint product offering. It is manufactured in state-of-the-art clean room environment to meet quality standards of the semiconductor industry. Several sub-products address particular properties and needs. Umicore´s Copper(II)oxide and Anode and Cathode solutions for ECD equipment are complementing our product offering and underline our competency in the segment of advanced packaging.
* Not available in Europe