Semiconductor Processes and Products

As functionality and reliability of electronic devices progress, requiring changes in systems development and integration, materials, chemicals and auxiliaries are undergoing significant adaptions in performance, cost-efficiency and reliability. 

In order to respond to such needs, Umicore´s business unit Metal Deposition Solutions offers innovative patented additives* for copper electroplating into the advanced packaging industry. Our modular additive system IntraCu^®* embodies an integral part of our product offering. It is manufactured in state-of-the-art clean room environment to meet quality standards of the semiconductor industry.

Several sub-products address particular properties and needs. Our Copper(II)oxide and Anode and Cathode solutions for ECD equipment are complementing our product offering and underline our competency in the segment of advanced packaging.

To complete our portfolio in the area of semiconductor processes, our Thin Film Products business line is at your disposal. They successfully develop, manufacture and supply high-quality evaporation materials and sputtering targets for thin film applications in the fields of advanced packaging, compounds, microsystems and silicon front-end segments.

Choose where you want to navigate quickly or scroll down for the entire content:

Our modular additives are designed to meet the highest requirements of the semiconductor industry in advanced packaging and offer the foundation for depositing customized material properties e.g. for Microbumps in IC packages, RDL in wafer level packaging and Pillar in flip-chip packaging.

IntraCu^® SC-2^*

System provides customers the opportunity to reduce total cost of ownership by extending their process window. In addition, it is a true 2in1 procedure that produces no or only a small number of Kirkendall-voids (KV-less). The system is a drop-in replacement for current POR offerings.

IntraCu^® SC-6^*

System provides customers the opportunity to make products that require thermal and mechanical stability in future, so that fine lines/structures will not break during subsequent packaging and assembly operations. Especially TAIKO wafers the process ensures no warping/damage. On glass or ceramic substrates IntraCu® SC-6 Cu layers provides best adhesion due low internal stress of the copper layer.

IntraCu^® SC-4^*

System has be specially designed for addressing morphological requirements for “Cu2Cu direct bonding” in 3D due the unique grain structure obtained. Its morphology remains largely unchanged after thermal excursions providing the basis for best pad height uniformity to allow further interconnect pitch scaling in W2W bonding. 

IntraCu^® VF-9^*

A copper plating process for simultaneously filling blind vias and reproducing fine line RDL with outstanding thickness distribution. In addition, the VF-9 can be seen as a real 3 in 1 process to be able to plate vias, RDL, as well as pillars.

AURUNA^® SC

A cyanide-free gold electroplating electrolyte for plating Gold with a purity of 99.99 %. The process is suitable for fine-pitched RDL wafers and Bump Plating. With the neutral pH range AURUNA^® SC is compatible with most common resist types for this application. The process offer a very wide current density range and is very stable (up to 1.2 A/dm²).

NiRUNA^® SC

A sulfamate based system with very low stress, boric acid free version available.

ARGUNA^® SC

Is a mild alkaline cyanide-free pure Silver plating. ARGUNA^® SC layers exhibit purity > 99 % providing resistivity and solderability in cyanide systems. The process features a wide compatibility with most resist types.    

Umicore Tin SC

Pure Sn plating process operate with a wide current density range. The Sn coatings are very pure and have low tendency for whisker growth. Very stable electrolyte system based on MSA. 

Umicore Indium SC

Umicore Indium SC systems deposit pure Indium layers over a very wide current density range. The stable electrolyte system is fully analysable and shows very good covering properties and uniform grain size.

Umicore copper oxide high purity metal oxide powder are developed, manufactured and quality tested in accordance with the demanding requirements of the semiconductor advanced packaging industry. In combination with Nova DMR^® concept (Direct Metal Replenishment) clean room usage is possible enabling lower cost of ownership for Cu replenishment along with a boost in performance of the electrolyte through higher Cu concentrations.

Insoluble anodes are proven to help increase process efficiency, reduce process costs, environmental impact and process control efforts in plating tools for advanced packaging. The key differentation of Umicore´s PLATINODE^® is the unique layer performance due to the manufacturing method using a molten salt electrolyte allowing ultra-high purity, low porosity and best ductility even at high Pt layer thicknesses.

• Function: providing best-in-class ductility and chemical resistance due to unique HTE coating of electrode
• Customized designs, contact materials and coatings
• Fully integrated production and clean room packaging: Built-to-Order or series
• Insoluble anodes and cathodes in qualification for several WLP/PLP ECD Tools

PLATINODE^® SC PtTi

• Molten salt deposited Pt on Ti substrate
• Developed for high ASD, predictable lifetime and outmost current distribution accuracy
• Pt thickness can be measured / correlated to lifetime 

PLATINODE^® SC MMO

• Developed for low organic consumption
• End of lifetime characterized by end of electrocatalytic function and wear rate
• Thickness cannot be measured / correlated to lifetime

^{* Not available in Europe}