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O & S highlight: Protection of functional surfaces - Umicore Sealing 691 optimal for reel-to-reel plating

Metal Deposition Solutions

A new tarnish and corrosion protection especially for functional layers is one of the highlight products of Umicore at this year's O & S in Stuttgart. From May 31 to Jun 2 (Tuesday to Thursday) the technology leader in electroplating presents at booth B28 / 42 in Hall 9, among others, Umicore Sealing 691. The product preserves surfaces, for example, of connectors, smart cards, printed circuit boards and other electronic components. It is ideally suited for short contact times in reel-to-reel plating. Electrical properties such as contact resistance, are not impaired. Mechanical characteristics such as the coefficient of friction improve even considerably.

Umicore Galvanotechnik GmbH is a partner in the joint stand of the Central Association for Surface Technology (ZVO) in Hall 9. Many engineers and plating experts of the company advise on its functional and decorative processes as well as dimensionally stable anodes.

Additionally, Umicore`s specialists inform, among others, about the benefits of electrolytically applied nickel phosphorus layers as an alternative to electroless nickel. Other topics include bronze zinc alloys on every-day items as well as rhodium, palladium and silver layers for electronic components.

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