ECTC Electronic Components and Technology Conference, USA
-
Orlando, United States
We invite you to visit the Electronic Components and Technology Conference (ECTC) from May 30 to June 2 in Orlando.
Together with our partner Shinhao Materials LLC we will give a presentation on 'Not All Nanograined Copper is Created Equal - In Pursuit of a Robust Low Temperature Copper to Copper Bonding Process' in Session 27 (Next Generation Wafer-to-Wafer Copper Bonding) on Friday June 2 9:30 AM — 12:35 PM.
For more details on the session and the show, please visit the official ECTC website.
ECTC Electronic Components and Technology Conference, USA
Umicore uses certain monitoring and tracking technologies such as cookies. These technologies are used in order to maintain, provide and improve our services on an ongoing basis, and in order to provide our web visitors with a better experience.
By clicking on the "Accept all" button you agree to the use of these cookies while using the website. For further information regarding how we use cookies and other tracking technologies, please see section 11 of our website privacy notice.
