ECTC Electronic Components and Technology Conference, USA

We invite you to visit the Electronic Components and Technology Conference (ECTC) from May 27 to 30 in Dallas. 

Together with imac we will give a presentation on 'Development and Characterization of Electrodeposited Tin-Indium Alloy Microbumps for Low Temperature Assembly' during the Interactive Presentations 3 on Thursday May 29 10:00 AM — 12:00 PM.

For more details on the session and the show, please visit the official ECTC website.