ECTC Electronic Components and Technology Conference, USA

We invite you to visit the Electronic Components and Technology Conference (ECTC) from May 30 to June 2 in Orlando. 

Together with our partner Shinhao Materials LLC we will give a presentation on 'Not All Nanograined Copper is Created Equal - In Pursuit of a Robust Low Temperature Copper to Copper Bonding Process' in Session 27 (Next Generation Wafer-to-Wafer Copper Bonding) on Friday June 2 9:30 AM — 12:35 PM.

For more details on the session and the show, please visit the official ECTC website.