Chemnitz Seminar

We are pleased to announce that our colleague Prof. Dr. Tsvetina Dobrovolska will present her latest research on “Annealing Behavior of Electroplated Nanograined Copper” at the 39th Chemnitz Seminar, to be held June 5-6, 2024 at the Frauenhofer Institute in Chemnitz.

The 39th Chemnitz Seminar will take place this time under the title "Electronic Packaging and Applications". During the two-day workshop, there will be discussions about current topics related to packaging and integration with representatives from industry and academia. This year, contributions on joining and integration technologies, novel materials, and additive manufacturing processes will be highlighted, along with insights into applications of microsystems technology.

Special highlights in addition to the presentations will include a laboratory tour, networking breaks, and a poster exhibition showcasing current focal points of the Fraunhofer ENAS team.

For further information, visit the official website of the organizer.