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Cu(II)Oxide High Purity Metal Salt

Cu(II)Oxide High Purity Metal Salt

Lower cost of ownership for Cu replenishment

Umicore copper oxide high purity metal oxide powder are developed, manufactured and quality tested in accordance with the demanding requirements of the semiconductor advanced packaging industry. In combination with ancosys DMR® concept (Direct Metal Replenishment) clean room usage is possible enabling lower cost of ownership for Cu replenishment along with a boost in performance of the electrolyte through higher Cu concentrations.

Advantages

  • No VMS Needed
    • H2SO4 concentration remaining consistent. Stable electrolyte volume, feed and bleed not needed
    • Several grades (4N, Packaging)
    • Full traceability, only one source for Cu
  • Cost Efficiency
    • Reduction tool down time, supporting maintenance-free plating chambers
    • 50% lower cost per kg Cu compared with VMS
    • 15% higher speed through higher Cu2+ (60g/l i/o 50g/l)

Applications

  • Semiconductors

Downloads

  • Produktblatt_Cu(II)Oxide_High_Purity_Metal_Salt_EN.pdf

Your contact person

Markus Legeler

Markus Legeler

Manager Sales International
T: +49 7171 607 204
F: +49 7171 607 316
Email

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