Productronica: Nickel-free processes in vogue

Great interest met the technology innovations of Umicore Electroplating again at this year's Productronica in Munich (10 to 13 November 2015). The company’s engineers advised a great number of booth visitors on latest PCB technology during the world's leading trade fair for development and manufacture of electronics.

Umicore Electroplating expects, in particular, nickel-free processes will continue to have increasing importance. They fulfill current standard requirements such as multiple soldering and bondability with aluminum and gold wires, even with pronounced thermal stress before assembly.

Nickel-free systems convince by high conductivity and are also suitable for ultra-fine pitch layouts. Umicore provides for PCB production, among other, processes such as EPIG (Electroless Palladium Immersion Gold) and ISIG (Immersion Silver Immersion Gold). They comply with RoHS and WEEE requirements and are ideally suited for high-frequency currents.

Umicore Electroplating is one of the world`s technology leader in specialty products for the manufacture of printed circuit boards and electronic components such as LEDs, smart cards and connectors. These include, among other, precious metal processes, pre- and post-treatment processes, anodes and solder resists. The company is also in Europe partner of Uyemura and chief representative of Taiyo.